Combined Milling & Implanting

This process step combines two essential components of smart card production in one system. Indentations are milled into the card bodies, which are designed according to the size of the module to be implanted. The IC modules are punched out of the tape before being inserted into the indentations and fixed in place. In the process, the hotmelt tape ensures adhesion of the module in the indentation, while the flexible bump guarantees a permanent connection.