Glue Tape Lamination
Glue tape lamination is the preparation of the module tapes for the hot melt process. IC Modules are laminated on the back side with an adhesive tape. For dual interface card production, a small modification is necessary to free the additional two positions which are later used for the Flexible Bump connection.
Mühlbauer's Glue Tape Lamination Systems
CML 201
- Easily accessible control electronics & pneumatics
- Automatic spooling systems for module & spacer tape
- SPS-driven operation system
- Locked production cabinet
- Best process ability with heating from top & bottom for 100% bubble-free glue lamination
- Sensor & mechanically controlled tape transport guarantees accurate glue film placement
- Tool change within seconds (without removal of module tape)
- Highest automatic production time
- Best cost-of-ownership ratio
- Up to 6,000 UPH (8-contact module tape) or 9,000 UPH (6-contact module tape)
