MB TeConnect®

The most advanced, reliable, and economical Dual Interface solution in the world. It is developed to help you produce the best quality Smart Cards for ID and banking with very low cost of ownership per card.

MB TeConnect® already holds:

• CQM© Certificate (by customer)
• VISA© Certificate (by customer)
• Union Pay© (by customer)
• MIR© (by customer)
• FOGRA (external Institution)
• Smithers Pira (external Institution)

Durability has already been tested in-house, with the cards meeting all ISO 24789 requirements for the longest possible life.

 

SIMPLE 3-STEP Production

• Real “INLINE” process enabling Pre-personalization as option
• Strongest Physical connection between antenna and chip
• Proven durability and reliability from external laboratories
• Inline Dual Interface production workflow
• MB-TeC 5000 paste is shipped as non hazardous substance

 

Highest Flexibility & Compatibility

• Flexible for any Dual Interface chip module application
• Freedom to choose different antenna types (Recommended: embedded copper wire antenna, edged antenna or wire with copper plates possible)
• Customized antenna design applicable
• Suitable for PVC, PC, ABS and many more inlay substrate material
• Proven 2nd generation technology with best cost per card ratio for highly competitive business

 

A Giant Step for DUAL INTERFACE Card Production

• Simple and flexible process with >10% cost reduction
• 100% proven best quality and durability with advanced technology
• Excellent reputation with over 35 years experience in the leading manufacturing industry
• Reliable fully automated system with more than 99.5% yield