Chip Module Testing & Pre-Personalization
Incoming chip modules are tested for electrical functionality and mechanical dimensions. Customized electrical tests can be performed according to different test patterns for contact and contactless chips. Identified reject modules are marked by reject punching, enabling the pre-personalization of a determined quantity of IC Modules.
Mühlbauer's Chip Module Testing & Pre-Personalization Systems
CMT 200
- Automatic test handler for contact & contactless IC Modules on (super) 35 mm tapes
- Easily accessible control electronics & pneumatics
- Automatic spooling systems for module tape & spacer tape
- SPS-driven operation system
- Fully automatic processing of test procedures
- Contact & contactless test systems available
- MCES / INCAPE ready
- Contact-IC up to 11,000 UPH & Contactless-IC up to 16,000 UPH
CMT 2280
- Compact & cost-efficient
- Easily accessible control electronics & pneumatics
- Automatic spooling systems for module tape & spacer tape
- Fully automatic processing of test & pre-personalization procedures
- Contact- (dual interface) & contactless interface test systems available
- User-friendly operator interface ETS
- MCES / INCAPE ready
- Up to 34,000 UPH
CMT 6560
- Most flexible & suitable for high volumes, especially for long coding procedures
- Easily accessible control electronics & pneumatics
- Automatic spooling systems for module spacer tape
- Fully automatic processing of test & pre-personalization procedures
- Contact, contactless & dual interface test systems available
- User friendly operator interface ETS
- MCES / INCAPE ready
- Up to 65,000 UPH
