FCM 10000 & CMTI
The All in One Flip Chip IC Module Production System
Mühlbauer’s FCM 10000 excels with its compact design, high output yield and excellent cost-efficiency. This system assembles the module tapes with chips directly from the wafer through Mühlbauer’s proven flip chip technology. A placing accuracy of ± 20 µm and a throughput of up to 9,500 UPH can be achieved – the equivalent of an annual capacity of 50 million modules.
The CMTI is integrated inline into the FCM 10000 for a fully automatic optical and electrical inspection. The CMTI provides full control of the chip placement with high precision optical measurement of position, size and contamination of chip bottom surface (depending on glue type and contrast). Additionally, an electrical test station can be integrated for ATR and functional tests as well as for pre-personalization. Faulty IC modules are clearly marked by a reject punch hole.
The 100% optical inspection during each bonding process guarantees highest production quality.
KEY FEATURES
- All-in-one Solution
- High-speed flip chip mounting of up to 9,500 UPH
- High placement accuracy of ±20µm
- A compact production & high-speed inspection line for IC modules
- Optical & electrical quality control of the finished product
DESIGN
- High-security access control with individual operator & service identification
- Menu-driven software, available in different languages
- Storage of process data
- Vacuum fixing of the tape at inspection position
- Input & output IC Module counter
- Detailed production data report (good/ reject modules)
THROUGHPUT
- Up to 9,500 modules per hour (depending on process specification)
Mühlbauer Group
Josef-Mühlbauer-Platz 1
93426 Roding Germany
Phone: +49 9461 952 0
Fax: +49 9461 952 1101
