TI 2280 & TI 2281
Tape Inspection
Mühlbauer’s tape inspection systems TI 2280 and TI 2281 perform a 100% thickness measurement check on 35mm IC Module tapes. Faulty modules are clearly marked using an automatic and x/y movable reject punch tool. The systems can either be integrated in the encapsulation system CME 3060 for inline inspection or can be operated as a stand-alone system for off-line quality control. The highlights of Mühlbauer’s TI systems are the integrated electrical test station which can finish the module even if the material is already isolated (disconnected). Furthermore, the TI series guarantees a 100% output quality control.
KEY FEATURES
- For 100% tested output
- 100% mechanical thickness measurement check
- Fully automatic optical inspection of glob tops & surfaces
- Operation as stand-alone or inline system
- Reject punch to mark faulty modules
- Integrated electrical final test station
NEW ON TI 2280
- Automatic, x/y movable reject punch tool
- 8-fold thickness measurement
NEW ON TI 2281
- Electrical test station for top/ bottom/ Dual Interface test
DESIGN
- Automatic spooling systems for module & spacer tapes with integrated tape buffers
- Automatic tape indexing system
- Vacuum fixing of the tape at measurement position
- Detailed production data report (good/reject modules)
- Graphical display & traceability file (optional)
- Menu-driven operator interface ETS
- Spooling systems or TS 1150/I, /O Variant: Diameter: 12.5, 25, 40, 56, 76 mm
- Integrated tape buffer for inline solution with CME 3060 (optional)
THROUGHPUT
- Up to 40,000 UPH, depending on process parameters
Mühlbauer Group
Josef-Mühlbauer-Platz 1
93426 Roding Germany
Phone: +49 9461 952 0
Fax: +49 9461 952 1101
