Mühlbauer RFID inlay systems cover all common ePassport and Smart Card applications whether it is ID-1 or ID-3 format and whether it is for Hybrid Cards, Dual Interface Cards or Contactless Cards.
For wire embedding and RFID inlay production, Mühlbauer offers with its MTT-series a real all-in-one-solution. All processes are in one modular system: Chip module punching, chip module implanting, ultrasonic wire embedding, thermo-compression chip welding as well as testing including bad unit marking.
The RFID inlay testing process step is highly important for quality assurance. The integrated transponders in the RFID pre-laminated, collated, laminated or inlay sheets are tested, ensuring that the complete output is fully functional.