The MB eSIM PERSO was developed to meet the dynamic connectivity requirements of the future. Micromodules that can perform a variety of functions with high processing capacity require proper handling. With over 25 years of experience in the semiconductor industry as well as expertise in handling the smallest devices especially in WLCSP and die sorting and packaging in tape and reel. All components of the system as well as the software have been highly integrated and optimized for maximum performance, speed and quality. Due to 100% in-house development, we guarantee shortest service response times and high spare parts availability. Depending on your application and your desired production volume,. our experts can offer you the most suitable laser solution.
KEY FEATURES
THROUGHPUT