Overview Strap Technology
Mühlbauer offers two different technologies for RFID Inlay Production: the commonly used Direct Chip Technology but also the special Strap Technology, where the chip is first attached to the strap and later to the antenna.
Mühlbauer's Strap Technology Systems
Strap Production - DDA
- Unwinder
- Adhesive Jetting
- Pre bond (Direct Die Attach) module
- Final bond (curing) module with tester and marker
Strap Attach - TMA 15000
- Unwinder
- Strap attach module
- Test unit for functional test incl. bad unit marking
- Upwinder
