Wide and narrow web solutions for flexible intelligence
- NEW: ALL IN ONE production solution
- Adhesive apply (either jetter via dispenser or printing)
- Conductive glue (such as ACP or ICP) or solder paste
- Flip chip (CSP) LED or SMD package LED attach
- SMD component assembly, i.e. electronics, sensors, connectors, batteries, lenses or RFID
- Placement accuracy of +/- 50µm
- In line curing (thermodes or reflow oven)
- Glop top unit for encapsulation
- Integrated test station
- Output slitting (optional)
- Wind up with support of spacer tape
- Throughput: Up to 15,000 / 40,000 UPH