10 years ago, the Direct Die Attach concept was born in Mühlbauer‘s development department and continuously optimized. The patented technology beats the 40 000 UPH with only one place system and a 30% smaller footprint. The significantly higher throughput and the reduced complexity result in 80% less die attach costs, an outstanding quality and highest reliability. This system redefines the high-volume production and provides high potential for further cost and performance optimization.
A New Dimension for Chip Attach