With the latest DS Merlin, Mühlbauer was able to achieve a new record throughput of up to 45,000 UPH – already including full vision and sidewall inspection. On top of the significantly increased speed, the DS MERLIN shows lowest cost of ownership since ever. The completely new construction method of the MERLIN’s core module features a special die ejector and smart pick & place wheel instead of the conventional bond head system. The machine and product setup have also been significantly simplified. Thanks to an automatic self-alignment system complex and long-lasting operator-related changeovers and setup times are no longer required. New products can be change over faster and easier than ever before. Aware that there is no compromise on quality, we integrate new construction of the inspection system with up to 4x infrared capability achieving an even higher output quality. Our sidewall, backsite, post place & new laser groove IR detects every tiny defect even within the die. A more intuitive software interface and an enhanced wafer handling complete this brand-new die sorting system and make it fastest at the market.
» Beating the 30.000 or 45.000 UPH incl. vision
» Ready for ultra small die handling (0.2 x 0.4 mm)
» Defect detection of 9µm defects and 5µm on sidewall
» Infrared inspection: sidewall, backside, post place and laser groove IR Inspection (down to 5 µm)