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DS VARIATION ecoLINE Mühlbauer’s overall goal with the new ecoLINE was to significantly lower the initial investment cost while, at the same time, keeping quality and functionality at a high level. Accordingly, the newly developed DS VARIATION ecoLINE excels especially through its cost efficient design for both hardware and software components. With the integrated high accuracy mode for the chip placement, a value of 20µm can be reached. All standard inspection features and especially the SIDEWALL inspection with its six-sided chip control are available helping to reach an even higher output yield. The DS VARIATION ecoLINE can process a whole range of niche applications as well as up to 12 inch reconstructed wafers.



ECO in all aspects

  • New cost efficient design and software
  • Low investment cost g one indexer
  • Highly flexibility sorting applications:
  • Both sorting modes are available: flip and non-flip
  • New software interface with Windows CE
  • Up to 12 inch (300 mm) reconstructed wafer
  • Fast conversion time between different products
  • Flexible output configuration with 2 Indexer ( 2 in 1) -> Dual Track
  • up to 7500 UPH



Get the best of all worlds with our 6-in-1 System!

Current marketing demanding for more flexibility, DS Variation Ecoline fits to the request with the capability to handle:


  • Wafer to reel
  • Reel to reel
  • Wafer to wafer
  • Jedec tray / carrier tray
  • Waffle pack / GelPack® 
  • Both flip and non-flip sorting modes
  • High Inspection accuracy with 12 MP motorzoom color camera
  • Wide range of defect detection (8 - 32µm) 
  • 100 % traceability and Smart Factory enabled


Mühlbauer's overall goal with the ecoLINE is to significantly lower to initial investment cost while, at the same time, keeping quality and functionally at a high level. Combine this with the flexibility mentioned;