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DS MERLIN WAFER-TO-WAFER / WAFER-TO-PANEL

High speed wafer-to-wafer / wafer-to-panel


With the new DS MERLIN, Mühlbauer was able to achieve a new record throughput of more than 40,000 UPH – already including full vision and sidewall inspection. On top of the significantly increased speed, the DS MERLIN shows 50% lower cost of ownership compared to other wafer-to-wafer solutions. The completely new construction method of the DS MERLIN’s core module features a special die ejector and a pick & place wheel instead of the conventional bonding technology. The machine and product setup have also been significantly simplified. With the completely automatic self-alignment system, a complex and long-lasting operator-related changeovers and set-up times are no longer required. New products can be introduced faster and easier than ever before. Due to the new construction, the inspection system with latest IR technology on sidewall and backside inspection reaches an even higher output quality. A more intuitive software interface and an enhanced wafer handling complete this brandnew die sorting system.

 

KEY FEATURES:

  • High speed Wafer-to-Wafer machine (up to 25.000 to over 40.000 UPH)
  • 12” wafer reconstruction or panel size up to 24” x24” (600x 600 mm)
  • Flip or Non-flip capability
  • 100% Vision Inspection
  • Simple process Wafer-to-Wafer / Wafer-to-Panel / jedec tray

» Ready for ultra small die handling 0.2 x 0.4 mm

  • Best compromise between speed and accuracy improvement

BENEFITS:

  • Including flip chip and 100% 6-side inspection

» Defect detection of 9µm defects and 5µm on sidewall
» Infrared: sidewall and backside IR inspection (down to 5 µm)

  • High placement accuracy ±20 µm - ±15 µm (optional)
  • 100% traceability with MB PalaMax®

THROUGHPUT:

  • Flip: 40.000 dies/hour with flip and sidewall
  • Non Flip: > 40.000 dies/hour with flip and sidewall