With the new DS MERLIN Mühlbauer was able to achieve a new record throughput of up to 45.000 UPH already including full vision and SIDEWALL inspection. On top of the significantly increased speed, the MERLIN shows 50% lower cost of ownership compared to other wafer to wafer solutions. The completely new construction method of the MERLIN’s core module shows a special die ejector and a pick & place wheel instead of the conventional dual bond heads and Z-Phi units. The machine and product setup have also been significantly simplified. With the completely automatic self alignment system a complex and long lasting change over and set up time are no longer required. New products can be teached faster and easier than ever before. Due to the new construction, the inspection system shows even more stable results, especially for the sensitive die frontside inspection. A more intuitive software interface and an enhanced wafer handling complete this brand new die sorting system.