The world’s benchmark in die sorting
With the new DS Merlin, Mühlbauer was able to achieve a new record throughput of up to 45,000 UPH – already including full vision and sidewall inspection. On top of the significantly increased speed, the DS MERLIN shows 20% lower cost of ownership compared to MERLIN 30k. The completely new construction method of the MERLIN’s core module features a special die ejector and a pick & place wheel instead of the conventional bond head system. The machine and product setup have also been significantly simplified. With the completely automatic self-alignment system complex and long-lasting operator-related changeovers and setup times are no longer required. New products can be introduced faster and easier than ever before. Due to the new construction, the inspection system with latest IR technology on sidewall and backside inspection reaches an even higher output quality. A more intuitive software interface and an enhanced wafer handling complete this brandnew die sorting system.
» No bond heads anymore
» Beating the 30.000 or 45.000 UPH incl. vision inspection
» Ready for ultra small die handling (0.2 x 0.4 mm)
» Defect detection of 9µm defects and 5µm on sidewall
» Infrared: sidewall and backside IR Inspection (down to 5 µm)